Detonation polycrystalline diamond powder and Similar polycrystalline diamond powder, strong cutting force and holding fore, high polishing precision, and high self-sharpening ability. Suitable for polishing silicon wafer, sapphire, magnetic head, optic lens, etc.

Type: monocrystalline diamond micron powder, diamond polishing powder, diamond abrasive dust
Sizes: micron size, from 0.1 to 50 um
Usage: diamond micro dust for polishing carbide, gemstone, wire die, glass, sapphire, semiconductor, etc. Or for making diamond lapping paste, diamond suspension, etc.

HDY -- General grade diamond micron powder for multi-purpose Manufactured on the basis of the diamond industry standard, which is the multi-purpose product. Relatively regular crystal form, good hardness and impact resistance, and few impurities, comparatively narrow particle size distribution. It can provide the satisfactory surface finish and material removal rates.

Diamond Polishing Paste: syringe package; bottled package;
Usage: Suitable for grinding and polishing metals, tungsten carbide, mold, alloy, glass, ceramic, semiconductor, jade, and other hard materials.

Diamond Lapping Compound for lapping and polishing usage
Features: High grinding force; Superfine surface finish; Uniform abrasive;
Package: 5g or 10g needle/ plastic bottle pacakge;
Logo can be customized for you needs.

Monocrystalline diamond powder is used to make stone, glass, gemstone, silicon crystal or other polishing products that require high precision and brightness equipment.

The polycrystalline diamond powder has more crystal edges and grinding surfaces than the single crystal diamond powder.

Diamond powder for diamond pad, use HDY, this type of diamond powder has good purity and particle size distribution to maintain consistency; grinding life cycle increased; impurities, magnetic properties and lower

The special diamond powder for elastic modules is a special diamond powder used to make elastic modules.

Diamond micron powder for diamond wire is specifically for silicon, sapphire cutting diamond wire saw. Through Yangge's control of particle size, removal of small particles and large particles in the product, the consumption of cutting materials is reduced