Precision Polishing Silicon Wafer Sapphire Usage Polycrystalline Diamond Powder
Detonation polycrystalline diamond powder and Similar polycrystalline diamond powder, strong cutting force and holding fore, high polishing precision, and high self-sharpening ability. Suitable for polishing silicon wafer, sapphire, magnetic head, optic lens, etc.
Diamond Micron Powder
Type: monocrystalline diamond micron powder, diamond polishing powder, diamond abrasive dust
Sizes: micron size, from 0.1 to 50 um
Usage: diamond micro dust for polishing carbide, gemstone, wire die, glass, sapphire, semiconductor, etc. Or for making diamond lapping paste, diamond suspension, etc.
HDY Diamond Micron Powder
HDY -- General grade diamond micron powder for multi-purpose Manufactured on the basis of the diamond industry standard, which is the multi-purpose product. Relatively regular crystal form, good hardness and impact resistance, and few impurities, comparatively narrow particle size distribution. It can provide the satisfactory surface finish and material removal rates.
Diamond Micron Powder for Diamond Wire
Diamond micron powder for diamond wire is specifically for silicon, sapphire cutting diamond wire saw. Through Yangge's control of particle size, removal of small particles and large particles in the product, the consumption of cutting materials is reduced