Diamond Micron Powder
Type: monocrystalline diamond micron powder
Usage: superfine abrasive for polishing
Sizes: micron size, from 0.1 to 50 um
Package: plastic bag or plastic bottle
Delivery way: DHL, Fedex, TNT, UPS, EMS, air or sea transportation
Diamond powder can be divided into many grades according to many different application and fetures.
Product Number: HDG, HDY, HDH, HDYZ, HDYH, HDYM, HDYX, HDYP, HDHC
HDY - General grade for multi-purpose
1. Relatively regular crystal form
2. Good hardness and impact resistance
3. Few impurities
4. Narrow particle size distribution.
5. The satisfactory surface finish and material removal rates.
for making the resin bond, vitrified bond or electroplated diamond tools.
Aim of polishing glass, ceramic, stone, concrete, gemstone, hard alloy, wire die, sapphire, semiconductors, etc.
Sizes from W0.1 to W50
HDG - Economical grade
Through the strict control material cost to guarantee customers` benefit. Particle size distribution in accordance with national standards. Irregular crystal form with low strength.
for making resin bond or vitrified bond diamond wheels, diamond pads, diamond Fickerts for low load working.etc,
Aim of grinding and polishing stone, ceramic, concrete, etc.
Sizes from W1 to W50
HDH - High hardness and purity grade
Manufactured on the basis of high strength and high purity diamond raw material. Regular crystal form with high hardness and good wear resistance, high thermal stability, and extremely low impurities. Narrow particle size distribution.
for making metal bond, vitrified bond or electroplate diamond tools, diamond polishing slurry, PCD, PDC, etc.
Aim of grinding and polishing semiconductors, silicon wafer, sapphire, optical glass, gemstones, precision bearings, seals, etc.
Sizes from W0.1 to W50
HDYZ - High precision process usage
Through the screening and reshape reprocesses, filtering out the flaky flat and strip particles, ensure to get the good crystal form, and meet the requirements about the high precision sawing, grinding and polishing usage.
for high precision sawing, grinding and polishing of glass, lens, silicon wafer，precision machinery, and hard alloy, etc.
Sizes from W0.5 to W50
HDYH - Round diamond micron powder for hard brittle material
1. Perfectly round crystal form
2. Concentrated particle size distribution
3. Fairly low magnetic
4. Avoid the chipping and scratches effectively
for making the electroplated grinding wheels, diamond suspension,etc. Mobile phone panel glass, optical glass lens, LED sapphire substrate, piston ring, ferrite, PTC thermistor, ceramic sealing ring, etc.
Sizes from W0.5 to W50
Less than 0.5 um sizes, for precise polishing
Multi-processing and classification on the basis of HDY grade, in order to select the less than 0.5 um particles size diamond powder, which also has the good crystal form and the narrow distribution of particle sizes. Aimed of the super polishing without scratch, reduce the defective rate of the workpiece.
the precision grinding and polishing of integrated circuit chip, optical glass, liquid crystal glass, gemstone, precision mechanics, sapphire, quartz plate, LED sapphire substrate and fine ceramic materials, etc.
Sizes are 0-0.1, 0-0.25, 0-0.5.
Alternative of blasting polycrystalline diamond powder (High-performance Similar polycrystalline diamond micron powder)
1. Rough surface with many contact points
2. Good self- sharpening ability
3. Improve the grinding efficiency greatly
4. Decrease the scratches effectively
Usage: for making diamond paste, diamond slurry, diamond suspension liquid, etc. Aim of polishing sapphire substrate, sapphire wafer, sapphire panel, mobile phone glass, camera lens, optics glass, etc.
Sizes from W3 to W50.
HDYX - Specialized Purpose for Diamond Wire
1. Spherical crystal form
2. Uniform particle size distribution
3. Great hardness
4. Improve the working efficiency
5. Reduce the material consumption of cutting loss
Usage: for making the diamond wire to slice or root the silicon wafer, sapphire, and quartz material. Also for high-precision electroplated diamond grinding wheels, and ultrathin diamond saw blades, etc.
Recommend sizes: ( unit: um)
5-10, 6-12, 8-12, 8-16, 10-15, 10-20, 20-30, 22-36, 30-40, 38-45, 40-50, 40-60, 60-70
HYHC - Specialized Purpose for PDC
1. High purity and high hardness
2. Good crystal form and surface finish
3. Uniform particle size distribution
4. High thermal conductivity
for making the polycrystalline diamond compact ( PDC cutter). Also for making polycrystalline diamond (PCD blanks).
Recommend sizes: ( unit: um )
1-2, 0.5-3, 1-3, 1.5-3,2-3, 2-4, 2-5, 3-6, 3-7, 4-8, 4-9, 5-10, 5-12, 6-12, 8-12, 8-16, 8-20, 10-20, 12-22, 12-22, 12-25, 15-25, 16-26, 20-30, 22-36, 20-40, 30-40, 25-45, 30-50, 40-50, 36-54, 40-60
Note: These sizes in the table are the common particle sizes, other sizes can be customized.
We have many advanced quality test machines for diamond powder. For example, high powder microscope, SEM electron microscope, Malvern laser particle size analyzer, particle scattered instrument, particle morphology analyzer, etc.
Some conventional sizes are kept in stock all the time, in order to meet the clients` urgent requirements.