Diamond Powder for Lapping Carbide Surface

Synthetic diamond micron powder can be divided into many grades according to many different application and fetures.
Product Number:  HDG,   HDY,   HDH,   HDYZ,   HDYH,   HDYM,   HDYX,   HDYP,   HDHC

 HDY diamond micron powder- General grade for multi-purpose

  Features:

   1. Relatively regular crystal form

   2. Good hardness and impact resistance

   3. Few impurities

   4. Narrow particle size distribution.

   5. The satisfactory surface finish and material removal rates.

  Usage:

  HDY synthetic diamond micro powder is used for making the resin bond, vitrified bond or electroplated diamond tools. 

  Aim of polishing glass, ceramic, stone, concrete,  gemstone, hard alloy, wire die, sapphire, semiconductors, etc.

 Sizes from W0.1 to W50
 

HDG micron diamond powder- Economical grade

 Features:

  Through the strict control material cost to guarantee customers' benefit. Particle size distribution in accordance with national standards. Irregular crystal form with low strength.

 Usage:

  HDG synthetic diamond powder abrasive is used for making resin bond or vitrified bond diamond wheels, diamond pads, diamond Fickerts for low load working.etc, 

  Aim of grinding and polishing stone, ceramic, concrete, etc.

  Sizes from W1 to W50
 

HDH - High hardness and purity grade

Features:

Manufactured on the basis of high strength and high purity diamond raw material. Regular crystal form with high hardness and good wear resistance, high thermal stability, and extremely low impurities. Narrow particle size distribution.

Usage: 

HDH diamond polishing powder is used for making metal bond, vitrified bond or electroplate diamond tools, diamond polishing slurry, PCD, PDC, etc. 

Aim of grinding and polishing semiconductors, silicon wafer, sapphire, optical glass, gemstones, precision bearings, seals, etc.

Sizes from W0.1 to W50

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 HDYZ - High precision process usage

 Features:

 Through the screening and reshape reprocesses, filtering out the flaky flat and strip particles, ensure to get the good crystal form, and meet the requirements about the high precision sawing, grinding and polishing usage.

 Usage: 

 HDYZ diamond polishing dust is uesd for high precision sawing, grinding and polishing of glass, lens, silicon wafer, precision machinery, and hard alloy, etc.

 Sizes from W0.5 to W50
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 HDYH - Round diamond micron powder for hard brittle material

 Features:

 1. Perfectly round crystal form

 2. Concentrated particle size distribution

 3.  Fairly low magnetic 

 4.  Avoid the chipping and scratches effectively

 Usage:

HDYH diamond micro dust is used for making the electroplated grinding wheels, diamond suspension,etc. Mobile phone panel glass, optical glass lens, LED sapphire substrate, piston ring, ferrite, PTC thermistor,  ceramic sealing ring, etc.

Sizes from W0.5 to W50

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 HDYM industrial diamond dust-Superfine type 

 Less than 0.5 um sizes, for precise polishing 

 Features:

 Multi-processing and classification on the basis of HDY grade, in order to select the less than 0.5 um particles size diamond abraisve powder dust, which also has the good crystal form and the narrow distribution of particle sizes. Aimed of the super polishing without scratch, reduce the defective rate of the workpiece.

Usage: 

HDYM diamond micro dust is uesd for the precision grinding and polishing of integrated circuit chip, optical glass, liquid crystal glass, gemstone, precision mechanics, sapphire, quartz plate, LED sapphire substrate and fine ceramic materials, etc.

Sizes are 0-0.1, 0-0.25, 0-0.5.
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  HDYP--Similar Polystalline Diamond Micron Powder 

 Alternative of blasting polycrystalline diamond powder   (High-performance Similar polycrystalline diamond micron powder)

 Features:

 1. Rough surface with many contact points 

 2. Good self- sharpening ability

 3. Improve the grinding efficiency greatly

 4. Decrease the scratches effectively

 Usage:
HDYP diamond polishing micron powder is used for making diamond paste, diamond slurry,  diamond  suspension liquid, etc. Aim of polishing sapphire substrate, sapphire wafer, sapphire panel, mobile phone glass, camera lens, optics glass,  etc.

Sizes from W3 to W50.
 

HDYX diamond grit micron- Specialized Purpose for Diamond Wire

Features:

1. Spherical crystal form

2. Uniform particle size distribution

3. Great hardness

4. Improve the working efficiency

5. Reduce the material consumption of cutting loss

Usage:  HDYX micro size synthetic diamond powder price is used for making the diamond wire to slice or root the silicon wafer, sapphire, and quartz material. Also for high-precision electroplated diamond grinding wheels, and ultrathin diamond saw blades, etc.

Recommend sizes: ( unit: um)

5-10, 6-12, 8-12, 8-16, 10-15, 10-20, 20-30, 22-36, 30-40, 38-45, 40-50, 40-60, 60-70
 

HYHC diamond dust abrasive - Specialized Purpose for PDC

 Features:

1. High purity and high hardness

2. Good crystal form and surface finish

3. Uniform particle size distribution

4. High thermal conductivity

Usage:  HDYC diamond powder is used for making the polycrystalline diamond compact ( PDC cutter). Also for making polycrystalline diamond (PCD blanks).

Recommend sizes: ( unit: um )

1-2, 0.5-3, 1-3, 1.5-3,2-3, 2-4, 2-5, 3-6, 3-7, 4-8, 4-9, 5-10, 5-12, 6-12, 8-12, 8-16, 8-20, 10-20, 12-22, 12-22, 12-25, 15-25, 16-26, 20-30, 22-36, 20-40, 30-40, 25-45, 30-50, 40-50, 36-54, 40-60